Duval, FabriceFabriceDuvalSabuncuoglu Tezcan, DenizDenizSabuncuoglu TezcanSwinnen, BartBartSwinnenSoussan, PhilippePhilippeSoussan2021-10-172021-10-172009https://imec-publications.be/handle/20.500.12860/15255Polymer deep trench filling and patterning for Through Silicon Via technologyProceedings paper