Integration of Cu and low-K dielectrics: effect of hard mask and dry etch on electrical performance of damascene structures

Donaton, R. A.R. A.DonatonCoenegrachts, BartBartCoenegrachtsMaenhoudt, MireilleMireilleMaenhoudtPollentier, IvanIvanPollentierStruyf, HerbertHerbertStruyfVanhaelemeersch, SergeSergeVanhaelemeerschVos, I.I.VosMeuris, MarcMarcMeurisFyen, WimWimFyenBeyer, GeraldGeraldBeyerTokei, ZsoltZsoltTokeiStucchi, MicheleMicheleStucchiVervoort, IwanIwanVervoortDe Roest, DavidDavidDe RoestMaex, KarenKarenMaex2021-10-142021-10-142001https://imec-publications.be/handle/20.500.12860/5261Integration of Cu and low-K dielectrics: effect of hard mask and dry etch on electrical performance of damascene structuresJournal article