On the fabrication of backside illuminated image sensors: bonding oxide, edge trimming and CMP rework routes

Cavaco, CelsoCelsoCavacoPeng, LanLanPengSebaai, FaridFaridSebaaiVerbinnen, GreetGreetVerbinnenVisker, JakobJakobViskerVan Olmen, JanJanVan OlmenSabuncuoglu Tezcan, DenizDenizSabuncuoglu TezcanOsman, HarisHarisOsman2021-10-222021-10-222015https://imec-publications.be/handle/20.500.12860/25037On the fabrication of backside illuminated image sensors: bonding oxide, edge trimming and CMP rework routesProceedings paperhttp://ecst.ecsdl.org/content/64/40/123.abstract