A fully 3-D BIE evaluation of the resistance and inductance of on-board and on-chip interconnects

Huynen, MartijnMartijnHuynenDe Zutter, DanielDanielDe ZutterVande Ginste, DriesDriesVande Ginste2021-10-252021-10-252018https://imec-publications.be/handle/20.500.12860/30932A fully 3-D BIE evaluation of the resistance and inductance of on-board and on-chip interconnectsProceedings paperhttps://ieeexplore.ieee.org/document/8401653