Minimizing within die non uniformity in CMP by optimising polishing parameters and consumables

Grillaert, JoostJoostGrillaertMeynen, HermanHermanMeynenWaeterloos, JoostJoostWaeterloosCoenegrachts, BartBartCoenegrachtsVan den hove, LucLucVan den hove2021-09-302021-09-301997https://imec-publications.be/handle/20.500.12860/1902Minimizing within die non uniformity in CMP by optimising polishing parameters and consumablesProceedings paper