Grinding and mixed silicon copper CMP of stacked patterned wafers for 3D integration

De Munck, KoenKoenDe MunckVaes, JanJanVaesBogaerts, LieveLieveBogaertsDe Moor, PietPietDe MoorVan Hoof, ChrisChrisVan HoofSwinnen, BartBartSwinnen2021-10-162021-10-162007https://imec-publications.be/handle/20.500.12860/11967Grinding and mixed silicon copper CMP of stacked patterned wafers for 3D integrationProceedings paper