Nucleation kinetics of electroless Cu deposition on ruthenium using glyoxylic acid as reducing agent

Inoue, FumihiroFumihiroInouePhilipsen, HaroldHaroldPhilipsenvan der Veen, MarleenMarleenvan der VeenVan Huylenbroeck, StefaanStefaanVan HuylenbroeckArmini, SilviaSilviaArminiStruyf, HerbertHerbertStruyfTanaka, TetsuTetsuTanaka2021-10-222021-10-2220140013-4651https://imec-publications.be/handle/20.500.12860/23983Nucleation kinetics of electroless Cu deposition on ruthenium using glyoxylic acid as reducing agentJournal articlehttp://dx.doi.org/10.1149/2.0361414jes