Finite element analysis of ultra thin BGA package: first and second level reliability

Limaye, PareshPareshLimayeVandevelde, BartBartVandeveldede Vries, HansHansde VriesDegryse, DominiekDominiekDegryseSlob, KeesKeesSlobvan Veen, CoCovan VeenLabie, RietRietLabie2021-10-152021-10-152004-05https://imec-publications.be/handle/20.500.12860/9204Finite element analysis of ultra thin BGA package: first and second level reliabilityProceedings paper