Thermal Aspects of Silicon Photonic Interposer Packages

Oprins, HermanHermanOprinsBan, YoojinYoojinBanCherman, VladimirVladimirChermanVan Campenhout, JorisJorisVan Campenhout2022-01-272021-11-022022-01-272022-01-272020naWOS:000618046600013https://imec-publications.be/handle/20.500.12860/38166Thermal Aspects of Silicon Photonic Interposer PackagesProceedings paper978-1-7281-6049-8WOS:000618046600013