Integration techniques and applications of thin chips on low cost foil substrates

van den Ende, DaanDaanvan den EndeSridhar, AshokAshokSridharvan den Brand, JeroenJeroenvan den BrandCauwe, MaartenMaartenCauweVandecasteele, BjornBjornVandecasteele2021-10-212021-10-212013https://imec-publications.be/handle/20.500.12860/23229Integration techniques and applications of thin chips on low cost foil substratesProceedings paper