Jacobs, Kristof J.P.Kristof J.P.JacobsStucchi, MicheleMicheleStucchiAfanasiev, ValeriValeriAfanasievGonzalez, MarioMarioGonzalezCroes, KristofKristofCroesDe Wolf, IngridIngridDe WolfBeyne, EricEricBeyne2021-10-252021-10-2520180003-6951https://imec-publications.be/handle/20.500.12860/30946Defect localization of metal interconnection lines in 3-dimensional through-silicon-via structures by differential scanning photocapacitance microscopyJournal articlehttps://aip.scitation.org/doi/full/10.1063/1.5012892