Enayati, AminAminEnayatiDe Raedt, WalterWalterDe RaedtVandenbosch, Guy A. E.Guy A. E.VandenboschRäisänen, Antti V.Antti V.Räisänen2026-07-092026-07-092011https://imec-publications.be/handle/20.500.12860/59773A multi-layer PCB technology is used to implement an antenna-in-package solution for millimeter-wave-frequency applications. The antenna is a 1×2 array of dipoles fed by a vialess balun structure. The measurement and simulation results are compared for return loss and radiation pattern characteristics.Proceedings paper10.23919/eumc.2011.6101953WOS:000411595800294