Embedding of chips in flex: a global optimization from thermal, mechanical and electrical RF perspective

Vandevelde, BartBartVandeveldeBrebels, StevenStevenBrebelsOkoro, ChukwudiChukwudiOkoroOprins, HermanHermanOprinsChen, L.C.L.C.ChenChristiaens, W.W.ChristiaensVanfleteren, JanJanVanfleteren2021-10-162021-10-162007https://imec-publications.be/handle/20.500.12860/13129Embedding of chips in flex: a global optimization from thermal, mechanical and electrical RF perspectiveProceedings paper