Damage layer in silica-based low-k material induced by the patterning plasma process studied by energy-filtered TEM

Richard, OlivierOlivierRichardIacopi, FrancescaFrancescaIacopiTokei, ZsoltZsoltTokeiBender, HugoHugoBender2021-10-162021-10-162005-04https://imec-publications.be/handle/20.500.12860/11105Damage layer in silica-based low-k material induced by the patterning plasma process studied by energy-filtered TEMProceedings paper