De Vos, JoeriJoeriDe VosStucchi, MicheleMicheleStucchiJourdain, AnneAnneJourdainBeyne, EricEricBeynePatel, JashJashPatelCrook, KathKathCrookCarruthers, MarkMarkCarruthersHopkins, JanetJanetHopkinsAshraf, HumaHumaAshraf2021-10-222021-10-222015https://imec-publications.be/handle/20.500.12860/25157Impact of backside processing on C-V characteristics of TSV capacitors in 3D stacked IC process flowsProceedings paper