Hu, Yu-HsiangYu-HsiangHuLiu, C.S.C.S.LiuLii, M.J.M.J.LiiRebibis, Kenneth JuneKenneth JuneRebibisJourdain, AnneAnneJourdainLa Manna, AntonioAntonioLa MannaBeyer, GeraldGeraldBeyerBeyne, EricEricBeyneYu,Yu2021-10-202021-10-202012-02https://imec-publications.be/handle/20.500.12860/208293D stacking using Cu-Cu direct bondingProceedings paper