3D stacking using bump-less process for sub 10μm pitches

Derakhshandeh, JaberJaberDerakhshandehDe Preter, IngeIngeDe PreterGerets, CarineCarineGeretsHou, LinLinHouHeylen, NancyNancyHeylenBeyne, EricEricBeyneBeyer, GeraldGeraldBeyerSlabbekoorn, JohnJohnSlabbekoornDubey, VikasVikasDubeyJourdain, AnneAnneJourdainPotoms, GoedeleGoedelePotomsInoue, FumihiroFumihiroInoueJamieson, GeraldineGeraldineJamiesonVandersmissen, KevinKevinVandersmissenSuhard, SamuelSamuelSuhardWebers, TomasTomasWebersCapuz, GiovanniGiovanniCapuzWang, TengTengWangRebibis, Kenneth JuneKenneth JuneRebibisMiller, AndyAndyMiller2021-10-232021-10-232016https://imec-publications.be/handle/20.500.12860/265373D stacking using bump-less process for sub 10μm pitchesProceedings paperhttp://ieeexplore.ieee.org/document/7545422/