A 160Gb/s (4x40) WDM O-band Tx subassembly using a 4-ch array of slicon rings co-packaged with a SiGe BiCMOS IC driver

Moralis-Pegios, M.M.Moralis-PegiosPitris, S.S.PitrisAlexoudi, T.T.AlexoudiTerzenidis, N.N.TerzenidisRamon, HannesHannesRamonLambrecht, JorisJorisLambrechtBauwelinck, JohanJohanBauwelinckYin, XinXinYinBan, YoojinYoojinBanDe Heyn, PeterPeterDe HeynVan Campenhout, JorisJorisVan CampenhoutLamprecht, T.T.LamprechtLehnman, A.A.LehnmanPleros, N.N.Pleros2021-10-272021-10-272019https://imec-publications.be/handle/20.500.12860/33625A 160Gb/s (4x40) WDM O-band Tx subassembly using a 4-ch array of slicon rings co-packaged with a SiGe BiCMOS IC driverProceedings paperhttps://ieeexplore.ieee.org/document/9125642