Cleaning requirement in the thinning module for 3D-Stacked IC (3D-SIC) integration

Wostyn, KurtKurtWostynZhao, MingMingZhaoCui, HushanHushanCuiLaermans, PatrickPatrickLaermansJourdain, AnneAnneJourdainVerbinnen, GreetGreetVerbinnenStruyf, HerbertHerbertStruyfDe Strycker, StevenStevenDe StryckerClaes, MartineMartineClaesTravaly, YoussefYoussefTravalyLeunissen, PeterPeterLeunissen2021-10-192021-10-192010https://imec-publications.be/handle/20.500.12860/18371Cleaning requirement in the thinning module for 3D-Stacked IC (3D-SIC) integrationMeeting abstract