A unique temporary bond solution based on a thermoplastic material tacky at room temperature and highly thermally resistant application extension from 3D-SIC to FO-WLP

Phommahaxay, AlainAlainPhommahaxayNakamura, AtsushiAtsushiNakamuraPotoms, GoedeleGoedelePotomsBertheau, JulienJulienBertheauBex, PieterPieterBexDuval, FabriceFabriceDuvalPodpod, ArnitaArnitaPodpodVerbinnen, GreetGreetVerbinnenKamochi, YoshitakaYoshitakaKamochiSawano, MitsuruMitsuruSawanoBeyer, GeraldGeraldBeyerSleeckx, ErikErikSleeckxBeyne, EricEricBeyne2021-10-242021-10-242017https://imec-publications.be/handle/20.500.12860/29175A unique temporary bond solution based on a thermoplastic material tacky at room temperature and highly thermally resistant application extension from 3D-SIC to FO-WLPOral presentation