Enabling porous low-k dielectric sealing against CVD Mn indiffusion in 22nm half-pitch (dual) damascene interconnects by deposition of sub-1nm thin organic films: from fundamentals to reliability

Armini, SilviaSilviaArminiLesniewska, AlicjaAlicjaLesniewskaJourdan, NicolasNicolasJourdanDelande, TinneTinneDelandeVega Gonzalez, VictorVictorVega GonzalezWilson, ChrisChrisWilsonStruyf, HerbertHerbertStruyfTokei, ZsoltZsoltTokei2021-10-242021-10-242017https://imec-publications.be/handle/20.500.12860/27765Enabling porous low-k dielectric sealing against CVD Mn indiffusion in 22nm half-pitch (dual) damascene interconnects by deposition of sub-1nm thin organic films: from fundamentals to reliabilityProceedings paper