Fine-pitch bonding technology with surface-planarized solder micro-bump/polymer hybrid for 3D integration

Inoue, FumihiroFumihiroInoueDerakhshandeh, JaberJaberDerakhshandehLofrano, MelinaMelinaLofranoBeyne, EricEricBeyne2022-03-012022-03-0120210021-4922WOS:000609147700001https://imec-publications.be/handle/20.500.12860/39200Fine-pitch bonding technology with surface-planarized solder micro-bump/polymer hybrid for 3D integrationJournal article10.35848/1347-4065/abd69cWOS:000609147700001