Okoro, ChukwudiChukwudiOkoroAgarwal, RahulRahulAgarwalLimaye, PareshPareshLimayeVandevelde, BartBartVandeveldeVandepitte, DirkDirkVandepitteBeyne, EricEricBeyne2021-10-182021-10-182010https://imec-publications.be/handle/20.500.12860/17728Insertion bonding: A novel Cu-Cu bonding approach for 3D integrationProceedings paper