30nm half-pitch metal patterning using MotifTM CD shrink technique and double patterning

Versluijs, JankoJankoVersluijsde Marneffe, Jean-FrancoisJean-Francoisde MarneffeGoossens, DannyDannyGoossensOp de Beeck, MaaikeMaaikeOp de BeeckVandeweyer, TomTomVandeweyerWiaux, VincentVincentWiauxStruyf, HerbertHerbertStruyfMaenhoudt, MireilleMireilleMaenhoudtBrouri, MohandMohandBrouriVertommen, JohanJohanVertommenKim, Ji SooJi SooKimZhu, HelenHelenZhuSadjadi, RezaRezaSadjadi2021-10-172021-10-172008https://imec-publications.be/handle/20.500.12860/1475530nm half-pitch metal patterning using MotifTM CD shrink technique and double patterningProceedings paper