Siew, Yong KongYong KongSiewSwerts, JohanJohanSwertsDictus, DriesDriesDictusEl-Mekki, ZaidZaidEl-MekkiArmini, SilviaSilviaArminiDordi, YezdiYezdiDordiYoon, AlexAlexYoonKolics, ArturArturKolicsBarbarin, YohanYohanBarbarinCroes, KristofKristofCroesBoemmels, JuergenJuergenBoemmelsTokei, ZsoltZsoltTokei2021-10-202021-10-202012https://imec-publications.be/handle/20.500.12860/21508Enabling sub 20nm Cu metallization with PEALD Ru-TiN barrier and ELD seedMeeting abstract