Formation, processing and characterization of Co-Sn intermetallic compounds for potential integration in 3D interconnects

Vakanas, GeorgeGeorgeVakanasO, MinhoMinhoODimcic, BiljanaBiljanaDimcicVanstreels, KrisKrisVanstreelsVandecasteele, BjornBjornVandecasteeleDe Preter, IngeIngeDe PreterDerakhshandeh, JaberJaberDerakhshandehRebibis, Kenneth JuneKenneth JuneRebibisKajihara, MasanoriMasanoriKajiharaDe Wolf, IngridIngridDe WolfBeyne, EricEricBeyne2021-10-222021-10-2220150167-9317https://imec-publications.be/handle/20.500.12860/26031Formation, processing and characterization of Co-Sn intermetallic compounds for potential integration in 3D interconnectsJournal articlehttp://www.sciencedirect.com/science/article/pii/S0167931715003640