Thermo-mechanical modeling of stress-induced-voiding in BEOL Cu interconnect structures

Lofrano, MelinaMelinaLofranoWilson, ChrisChrisWilsonCroes, KristofKristofCroesVandevelde, BartBartVandevelde2021-10-182021-10-182009https://imec-publications.be/handle/20.500.12860/15738Thermo-mechanical modeling of stress-induced-voiding in BEOL Cu interconnect structuresProceedings paper