Tang, TiffanyTiffanyTangGuerrero, AliceAliceGuerreroCuypers, DieterDieterCuypersMacours, MaartenMaartenMacoursVaquilar, AldrinAldrinVaquilarBex, PieterPieterBexKennes, KoenKoenKennesPhommahaxay, AlainAlainPhommahaxayBeyer, GeraldGeraldBeyerBeyne, EricEricBeyne2026-03-242026-03-242025979-8-3315-3933-70569-5503https://imec-publications.be/handle/20.500.12860/58932This study aims to link several epoxy mold compound (EMC) material properties to warpage and die-shift that are typically present in a fanout wafer level packaging process flow with RDL last process conditions. Two EMC compounds with different CTE, Tg, and modulus are evaluated and compared for warpage and die-shift performance on a next generation temporary bonding material (TBM). A low CTE and high Tg seem to be very beneficial to achieve low warpage on blanket mold on TBM wafers. When dies are embedded, the modulus plays a major role in order to mitigate thermal stresses that occur due to the Si-mold CTE mismatch during molding.engProceedings paper10.1109/ECTC51687.2025.00346WOS:001537918100335