In-depth Raman spectroscopy analysis of various parameters affecting the mechanical stress near the surface and bulk of Cu-TSVs

De Wolf, IngridIngridDe WolfSimons, VeerleVeerleSimonsCherman, VladimirVladimirChermanLabie, RietRietLabieVandevelde, BartBartVandeveldeBeyne, EricEricBeyne2021-10-202021-10-202012https://imec-publications.be/handle/20.500.12860/20570In-depth Raman spectroscopy analysis of various parameters affecting the mechanical stress near the surface and bulk of Cu-TSVsProceedings paper