Comparison between wet and dry silicon via reveal in 3D backside processing

Thomas, DaveDaveThomasHopkins, JanetJanetHopkinsAshraf, HumaHumaAshrafPatel, JashJashPatelAnsell, OliverOliverAnsellJourdain, AnneAnneJourdainDe Vos, JoeriJoeriDe VosMiller, AndyAndyMillerBeyne, EricEricBeyne2021-10-222021-10-222015https://imec-publications.be/handle/20.500.12860/25992Comparison between wet and dry silicon via reveal in 3D backside processingProceedings paper