Saleh, AhmedAhmedSalehCroes, KristofKristofCroesCeric, HajdinHajdinCericDe Wolf, IngridIngridDe WolfZahedmanesh, HoumanHoumanZahedmanesh2025-06-112024-12-062025-06-1120242079-4991WOS:001365922900001https://imec-publications.be/handle/20.500.12860/44929A Comprehensive Microstructure-Aware Electromigration Modeling Framework; Investigation of the Impact of Trench Dimensions in Damascene Copper InterconnectsJournal article10.3390/nano14221834WOS:001365922900001VOID NUCLEATIONGRAIN-SIZESTRESSINTERFACESSIMULATIONMIGRATIONEVOLUTIONLINES