An analysis of the reliability of a wafer level package (WLP) using a silicon under the bump (SUB) configuration

Gonzalez, MarioMarioGonzalezVandevelde, BartBartVandeveldeVanden Bulcke, MathieuMathieuVanden BulckeWinters, ChristopheChristopheWintersBeyne, EricEricBeyneLee, Y.J.Y.J.LeeHarkness, B.R.B.R.HarknessMohamed, M.M.MohamedMeynen, H.H.MeynenVanlathem, E.E.Vanlathem2021-10-152021-10-152003https://imec-publications.be/handle/20.500.12860/7618An analysis of the reliability of a wafer level package (WLP) using a silicon under the bump (SUB) configurationProceedings paper