IR-Drop Analysis of Hybrid Bonded 3D-ICs with Backside Power Delivery and mu- & n- TSVs

Genneret, B.B.GenneretChou, R.R.ChouSisto, GiulianoGiulianoSistoChehab, BilalBilalChehabBaert, RogierRogierBaertChen, RongmeiRongmeiChenWeckx, PieterPieterWeckxRyckaert, JulienJulienRyckaertVan der Plas, GeertGeertVan der PlasBeyne, EricEricBeyneMilojevic, DragomirDragomirMilojevic2022-05-052022-05-052022-05-0520212380-632XWOS:000784773200051https://imec-publications.be/handle/20.500.12860/39749IR-Drop Analysis of Hybrid Bonded 3D-ICs with Backside Power Delivery and mu- & n- TSVsProceedings paper10.1109/IITC51362.2021.9537541978-1-7281-7632-1WOS:000784773200051DIE