Low warpage wafer level transfer molding post 3D die to wafer assembly

Cadacio Jr., FranciscoFranciscoCadacio Jr.Wang, TengTengWangSalahouelhadj, AbdellahAbdellahSalahouelhadjCapuz, GiovanniGiovanniCapuzPotoms, GoedeleGoedelePotomsRebibis, Kenneth JuneKenneth JuneRebibisMiller, AndyAndyMillerBeyer, GeraldGeraldBeyerBeyne, EricEricBeyneGal, WilfredWilfredGalZijl, JurrianJurrianZijlKersjes, SebastiaanSebastiaanKersjesWensink, HenkHenkWensink2021-10-232021-10-232016https://imec-publications.be/handle/20.500.12860/26386Low warpage wafer level transfer molding post 3D die to wafer assemblyProceedings paperhttp://ieeexplore.ieee.org/document/7545526/?arnumber=7545526