Scalable, sub 2μm pitch, Cu/SiCN to Cu/SiCN hybrid wafer-to-wafer bonding technology

Beyne, EricEricBeyneKim, Soon-WookSoon-WookKimPeng, LanLanPengHeylen, NancyNancyHeylenDe Messemaeker, JokeJokeDe MessemaekerOkudur, Oguzhan OrkutOguzhan OrkutOkudurPhommahaxay, AlainAlainPhommahaxayKim, Tae-GonTae-GonKimStucchi, MicheleMicheleStucchiVelenis, DimitriosDimitriosVelenisMiller, AndyAndyMillerBeyer, GeraldGeraldBeyer2021-10-242021-10-242017https://imec-publications.be/handle/20.500.12860/27845Scalable, sub 2μm pitch, Cu/SiCN to Cu/SiCN hybrid wafer-to-wafer bonding technologyProceedings paperhttp://ieeexplore.ieee.org/document/8268486/