Investigation of chip-to-chip interconnections for memory-logic communication on 3D interposer technology

Roda Neve, CesarCesarRoda NeveRyckaert, JulienJulienRyckaertVan der Plas, GeertGeertVan der PlasDetalle, MikaelMikaelDetalleBeyne, EricEricBeynePantano, NicolasNicolasPantanoVerhelst, MarianMarianVerhelst2021-10-222021-10-222014https://imec-publications.be/handle/20.500.12860/24441Investigation of chip-to-chip interconnections for memory-logic communication on 3D interposer technologyProceedings paperhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6844528&sortType%3Dasc_p_Sequence%26filter%3DAND(p_IS_Number%3A684452