Silicone for flexible packaging of thin dies (<20 μm) using wafer level techniques

Iker, FrancoisFrancoisIkerDe Preter, IngeIngeDe PreterGonzalez, MarioMarioGonzalezSoussan, PhilippePhilippeSoussan2021-10-172021-10-172008https://imec-publications.be/handle/20.500.12860/13914Silicone for flexible packaging of thin dies (<20 μm) using wafer level techniquesProceedings paper