Hou, LinLinHouChery, EmmanuelEmmanuelCheryCroes, KristofKristofCroesTierno, DavideDavideTiernoChew, Soon AikSoon AikChewChen, YangyinYangyinChenRakbin, PeterPeterRakbinBeyne, EricEricBeyne2023-06-082022-11-152023-06-082022-031938-1891https://imec-publications.be/handle/20.500.12860/40739Reliability Investigation of W2W Hybrid Bonding Interface: Breakdown Voltage and Leakage MechanismProceedings paperMaterials scienceWafer-To-Wafer (W2W) bondingreliabilitydielectric breakdownhybrid pad leakage