Analysis of the size effect in electroplated fine copper wires and a realistic assessment to model copper resistivity

Zhang, WenqiWenqiZhangBrongersma, SywertSywertBrongersmaLi, ZhenZhenLiLi, dagangdagangLiRichard, OlivierOlivierRichardMaex, KarenKarenMaex2021-10-162021-10-162007https://imec-publications.be/handle/20.500.12860/13262Analysis of the size effect in electroplated fine copper wires and a realistic assessment to model copper resistivityJournal article