Post-bond interconnect test and diagnosis for 3D memory stacked on logic

Taouil, MottaqiallahMottaqiallahTaouilMasadeh, MahmoudMahmoudMasadehHamdioui, SaidSaidHamdiouiMarinissen, Erik JanErik JanMarinissen2021-10-222021-10-222015-110278-0070https://imec-publications.be/handle/20.500.12860/25984Post-bond interconnect test and diagnosis for 3D memory stacked on logicJournal articlehttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7105883