Development of sub-10-nm atomic layer deposition barriers for Cu/low-k interconnects

Beyer, GeraldGeraldBeyerSatta, AlessandraAlessandraSattaSchuhmacher, JörgJörgSchuhmacherMaex, KarenKarenMaexBesling, WimWimBeslingKilpela, OlliOlliKilpelaSprey, HesselHesselSpreyTempel, GeorgGeorgTempel2021-10-142021-10-142002https://imec-publications.be/handle/20.500.12860/6009Development of sub-10-nm atomic layer deposition barriers for Cu/low-k interconnectsJournal article