Pinel, S.S.PinelTasselli, J.J.TasselliBailbe, J. P.J. P.BailbeMarty, A.A.MartyMarco, S.S.MarcoMorante, J. R.J. R.MoranteBeyne, EricEricBeyneVan Hoof, RitaRitaVan HoofVendier, O.O.VendierHuan, M.M.Huan2021-10-142021-10-142001https://imec-publications.be/handle/20.500.12860/5579Thermal management in a new ultra-thin chip stack technologyProceedings paper