Sun, XiaoXiaoSunVan der Plas, GeertGeertVan der PlasDetalle, MikaelMikaelDetalleBeyne, EricEricBeyne2021-10-222021-10-222014https://imec-publications.be/handle/20.500.12860/24576Analysis of 3D interconnect performances Versus Si interposer substrate resistivityProceedings paper