Characterization of the thermal impact of Cu-Cu bonds achieved using TSVs on hot spot dissipation in 3D stacked ICs

Oprins, HermanHermanOprinsCherman, VladimirVladimirChermanVandevelde, BartBartVandeveldeTorregiani, CristinaCristinaTorregianiStucchi, MicheleMicheleStucchiVan der Plas, GeertGeertVan der PlasMarchal, PolPolMarchalBeyne, EricEricBeyne2021-10-192021-10-192011-05https://imec-publications.be/handle/20.500.12860/19520Characterization of the thermal impact of Cu-Cu bonds achieved using TSVs on hot spot dissipation in 3D stacked ICsProceedings paper