Thermo-mechanical design of a generic 0-level MEMS package using chip capping and Through Silicon Via's

Vandevelde, BartBartVandeveldeJansen, RoelofRoelofJansenBouwstra, SiebeSiebeBouwstraPham, NgaNgaPhamMajeed, BivraghBivraghMajeedLimaye, PareshPareshLimayeBeyne, EricEricBeyneTilmans, HarrieHarrieTilmans2021-10-182021-10-182010https://imec-publications.be/handle/20.500.12860/18227Thermo-mechanical design of a generic 0-level MEMS package using chip capping and Through Silicon Via'sProceedings paper