Integration of low stress photopatternable silicones into a wafer level package

Gardner, G.G.GardnerHarkness, B.B.HarknessOhare, E.E.OhareMeynen, H.H.MeynenVanden Bulcke, MathieuMathieuVanden BulckeGonzalez, MarioMarioGonzalezBeyne, EricEricBeyne2021-10-152021-10-152004-06https://imec-publications.be/handle/20.500.12860/8939Integration of low stress photopatternable silicones into a wafer level packageProceedings paper