Vandooren, AnneAnneVandoorenWitters, LiesbethLiesbethWittersFranco, JacopoJacopoFrancoMallik, ArindamArindamMallikParvais, BertrandBertrandParvaisWu, Z.Z.WuWalke, AmeyAmeyWalkeDeshpande, ParuParuDeshpandeRosseel, ErikErikRosseelHikavyy, AndriyAndriyHikavyyLi, WaikinWaikinLiPeng, L.L.PengRassoul, NouredineNouredineRassoulJamieson, GeraldineGeraldineJamiesonInoue, FumihiroFumihiroInoueVerbinnen, GreetGreetVerbinnenDevriendt, KatiaKatiaDevriendtTeugels, LieveLieveTeugelsHeylen, NancyNancyHeylenVecchio, EmmaEmmaVecchioZheng, T.T.ZhengWaldron, NiamhNiamhWaldronDe Heyn, VincentVincentDe HeynMocuta, DanDanMocutaCollaert, NadineNadineCollaert2021-10-262021-10-262018https://imec-publications.be/handle/20.500.12860/32140Sequential 3D: Key integration challenges and opportunities for advanced semiconductor scalingProceedings paperhttps://ieeexplore.ieee.org/document/8399777/