Cu-Cu insertion bonding technique using photosensitive polymer as WLUF

Potoms, GoedeleGoedelePotomsWang, TengTengWangDerakhshandeh, JaberJaberDerakhshandehDaily, RobertRobertDailyCapuz, GiovanniGiovanniCapuzGonzalez, MarioMarioGonzalezBeyer, GeraldGeraldBeyerRebibis, Kenneth JuneKenneth JuneRebibisMiller, AndyAndyMillerBeyne, EricEricBeyne2021-10-222021-10-222014https://imec-publications.be/handle/20.500.12860/24397Cu-Cu insertion bonding technique using photosensitive polymer as WLUFProceedings paperhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7028331