Study of the effect of dielectric porosity on the stress in advanced Cu/low-k interconnects using x-ray diffraction

Wilson, ChrisChrisWilsonZhao, ChaoChaoZhaoZhao, LarryLarryZhaoMetzger, T.H.T.H.MetzgerTokei, ZsoltZsoltTokeiCroes, KristofKristofCroesPantouvaki, MariannaMariannaPantouvakiBeyer, GeraldGeraldBeyerHorsfall, A.B.A.B.HorsfallO Neill, A.G.A.G.O Neill2021-10-182021-10-1820090003-6951https://imec-publications.be/handle/20.500.12860/16549Study of the effect of dielectric porosity on the stress in advanced Cu/low-k interconnects using x-ray diffractionJournal article