Microstrip thin-film MCM-D technology as enabling platform for the integration of high-performance SiP modules

Posada Quijano, GuillermoGuillermoPosada QuijanoCarchon, GeertGeertCarchonSoussan, PhilippePhilippeSoussanPham, NgaNgaPhamMajeed, BivraghBivraghMajeedSabuncuoglu Tezcan, DenizDenizSabuncuoglu TezcanRuythooren, WouterWouterRuythoorenNauwelaers, BartBartNauwelaersDe Raedt, WalterWalterDe RaedtBeyne, EricEricBeyne2021-10-162021-10-162007-11https://imec-publications.be/handle/20.500.12860/12734Microstrip thin-film MCM-D technology as enabling platform for the integration of high-performance SiP modulesMeeting abstract